TE Connectivity 173977-6
TE Connectivity 173977-6

TE Connectivity 173977-6

Brand

TE Connectivity

Mfr. Part #

173977-6

Description

Headers & Wire Housings 2MM 6P HSG

Datasheet

173977-6

Status

In stock

Specifications

55
Attributes Value Search
Category Headers & Wire Housings
Brand TE Connectivity
RoHS
Product Wire Housings
Type Receptacle Housing
Number of Positions 6 Position
Pitch 2 mm (0.079 in)
Number of Rows 1 Row
Termination Style IDC
Mounting Angle Stragiht
Contact Gender Socket (Female)
Contact Plating Tin
Series AMP CT
Tradename Common Termination
Application Wire-to-Board
Wire Gauge 28 AWG to 26 AWG
Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 105 C
Packaging Bulk
Brand TE Connectivity
Contact Material Phosphor Bronze
Contact Type Socket (Female)
Current Rating 2 A
Housing Color Natural
Housing Material Polybutylene Terephthalate (PBT)
Product Type Headers & Wire Housings
SPQ 1000
Subcategory Headers & Wire Housings
Voltage Rating 125 V
Unit Weight 0.011817 oz
55

Related Products

Molex 39-01-2025
Molex 39-01-2025
Headers & Wire Housings 2 CKT RCPT HOUSING
Würth Elektronik 61300611121
Würth Elektronik 61300611121
Headers & Wire Housings WR-PHD 2.54mm 6Pin T HT Header
Amphenol FCI 10141272-211ALF
Amphenol FCI 10141272-211ALF
Headers & Wire Housings Microspace Crimp To Wire Female Tin AWG 22
Amphenol FCI10141272-213ALF
Amphenol FCI10141272-213ALF
Headers & Wire Housings Microspace Crimp To Wire Female Tin AWG 24
Amphenol FCI 87402-145
Amphenol FCI 87402-145
Headers & Wire Housings RIB CAGE R/A HDR
Amphenol FCI 10170437-11103KLF
Amphenol FCI 10170437-11103KLF
Headers & Wire Housings 1.27MM MINITEK MICROSPACE
Contact
Favorites

  • Product Code: 173977-6

  • Views: 14

FOR MORE INFORMATION
Upload BOM list

POLICIES, REGULATIONS & RULES

Featured Products

Famous Manufacturers

Analog Devices
Diodes Incorporated
ROHM Semiconductor
Toshiba
NXP
Infineon Technologies
Micron Technology
Skyworks Solutions, Inc.
Nexperia
Mini-Circuits
Analog Devices / Maxim Integrated
Vishay Semiconductors
Chemi-Con
KEMET
KYOCERA AVX
MURATA
TAIYO YUDEN
Rubycon
TDK
Vishay / BC Components
GigaDevice
Micro Commercial Components (MCC)
TE Connectivity
YAGEO
Onsemi
Littelfuse
American Bright LED
ams OSRAM
Cree LED
Wurth Elektronik
Lumileds
Lite-On
Luminus Devices
Broadcom / Avago
Amphenol FCI
Hirose Electric
Molex
Samtec
Phoenix Contact
HARTING
Samsung Electro-Mechanics
Walsin
Harwin
Bourns
EPCOS / TDK
Monolithic Power Systems (MPS)
Nichicon
Bussmann / Eaton
Coilcraft
SEI Stackpole
IRC / TT Electronics
KOA Speer
Welwyn Components / TT Electronics
WeEn Semiconductors
Renesas Electronics
Renesas / Intersil
Alpha and Omega Semiconductor, Inc.
IXYS
Torex Semiconductor
Fortune Semicon
Central Semiconductor
Comchip Technology
Panjit
Sharp Microelectronics
Optek / TT Electronics
Everlight
MaxLinear
FTDI, Future Technology Devices International Ltd
Silicon Labs
Apex Microtechnology
Nisshinbo
Alliance Memory
Diotec Semiconductor
ISSI
Intelligent Memory
Winbond
AMD
Lattice Semiconductor
Altera
Amphenol Advanced Sensors
Ametherm
Astrodyne TDI
CUI Inc.
Delta Electronics
TDK-Lambda
Vicor
Johanson Technology
LRC - LESHAN RADIO COMPANY, LTD.
MACOM
Qorvo
SK HYNIX
Cornell Dubilier - CDE
Eaton Electronics
Maxwell Technologies
WIMA
MEAN WELL
Schaffner
ROYALOHM
Kingbright
Yamaichi Electronics
Silergy Corp
Richtek
Advanced Monolithic Systems
Kiwi Instruments
SGMICRO
WIZnet
Quectel
Espressif Systems
ROQANG
AISHI(Aihua Group)
CCTC
FH (Guangdong Fenghua Advanced Tech)
Same Sky
GCT
Pulse Electronics
Intel
CHiNT
STMicroelectronics
Microchip Technology
Texas Instruments
NEC
Samsung
Qualcomm
Panasonic
Chat Chat