Phoenix Contact 1378326
Phoenix Contact 1378326

Phoenix Contact 1378326

Brand

Phoenix Contact

Mfr. Part #

1378326

Description

Headers & Wire Housings DD21H 0,85/20-H-2,5-X

Datasheet

1378326

Status

In stock

Specifications

53
Attributes Value Search
Category Headers & Wire Housings
Brand Phoenix Contact
RoHS
Product PCB Headers
Number of Positions 120 Position
Pitch 2.5 mm (0.098 in)
Number of Rows 2 Row
Mounting Style PCB Mount
Termination Style Solder
Mounting Angle Right Angle
Contact Gender Pin (Male)
Contact Plating Tin
Termination Post Length 3.4 mm (0.134 in)
Series CONNEXIS
Application Wire-to-Board
Minimum Operating Temperature - 55 C
Maximum Operating Temperature + 105 C
Packaging Bulk
Brand Phoenix Contact
Contact Material Copper
Current Rating 5 A
Flammability Rating UL 94 V-0
Housing Color Black
Housing Gender Male
Housing Material Polybutylene Terephthalate (PBT)
Insulation Resistance 5 MOhms
Product Type Headers & Wire Housings
SPQ 50
Subcategory Headers & Wire Housings
Voltage Rating 160 V
53

Related Products

Amphenol FCI 10141272-211ALF
Amphenol FCI 10141272-211ALF
Headers & Wire Housings Microspace Crimp To Wire Female Tin AWG 22
Amphenol FCI10141272-213ALF
Amphenol FCI10141272-213ALF
Headers & Wire Housings Microspace Crimp To Wire Female Tin AWG 24
Amphenol FCI 87402-145
Amphenol FCI 87402-145
Headers & Wire Housings RIB CAGE R/A HDR
Amphenol FCI 10170437-11103KLF
Amphenol FCI 10170437-11103KLF
Headers & Wire Housings 1.27MM MINITEK MICROSPACE
Amphenol FCI 10159560-A00221RLF
Amphenol FCI 10159560-A00221RLF
Headers & Wire Housings Powerstak Vertical H eader 10pos
Amphenol FCI 10144041-04011LF
Amphenol FCI 10144041-04011LF
Headers & Wire Housings 4 POS RA SMT HEADER
Contact
Favorites

  • Product Code: 1378326

  • Views: 3

FOR MORE INFORMATION
Upload BOM list

POLICIES, REGULATIONS & RULES

Featured Products

Famous Manufacturers

Analog Devices
Diodes Incorporated
ROHM Semiconductor
Toshiba
NXP
Infineon Technologies
Micron Technology
Skyworks Solutions, Inc.
Nexperia
Mini-Circuits
Analog Devices / Maxim Integrated
Vishay Semiconductors
Chemi-Con
KEMET
KYOCERA AVX
MURATA
TAIYO YUDEN
Rubycon
TDK
Vishay / BC Components
GigaDevice
Micro Commercial Components (MCC)
TE Connectivity
YAGEO
Onsemi
Littelfuse
American Bright LED
ams OSRAM
Cree LED
Wurth Elektronik
Lumileds
Lite-On
Luminus Devices
Broadcom / Avago
Amphenol FCI
Hirose Electric
Molex
Samtec
Phoenix Contact
HARTING
Samsung Electro-Mechanics
Walsin
Harwin
Bourns
EPCOS / TDK
Monolithic Power Systems (MPS)
Nichicon
Bussmann / Eaton
Coilcraft
SEI Stackpole
IRC / TT Electronics
KOA Speer
Welwyn Components / TT Electronics
WeEn Semiconductors
Renesas Electronics
IXYS
Torex Semiconductor
Central Semiconductor
Comchip Technology
Panjit
Sharp Microelectronics
Optek / TT Electronics
Everlight
MaxLinear
FTDI, Future Technology Devices International Ltd
Silicon Labs
Apex Microtechnology
Nisshinbo
Alliance Memory
Diotec Semiconductor
ISSI
Intelligent Memory
Winbond
Intel
CHiNT
STMicroelectronics
Microchip Technology
Texas Instruments
NEC
Samsung
Qualcomm
Panasonic
Chat Chat